
ʻenehana ICSLOVE
E pili anaMākou
Ua hoʻokumu ʻia ʻo Shenzhen ICSLOVE Technology CO., LTD ma Shenzhen, ʻo ia hoʻi ka "Chinese Silicon Valley" i ka makahiki 2020 (kahi hānau o nā ʻoihana e like me Huawei, BYD a me DJI etc.) hana nui i ka hana ʻana o ka papa kaapuni paʻi (PCB) a me ka PCB Assembly, a hāʻawi i ke kūʻai ʻana i nā ʻāpana Electronics, e like me ka brand semiconductor o TI, ADI, ST, MICROCHIP, MURATA, Tyco a me nā hōʻailona kaulana ʻē aʻe o ka honua a he nui kā mākou mau mea e kaʻana like ai i nā mea kūʻai aku. ʻO kā mākou waihona nui ka mana ʻoihana, kaʻa, ke kamaʻilio ʻana, ka lāʻau lapaʻau, ka aerospace, IOT, Anti-Drone etc. Mai nā prototypes PCBA wikiwiki a me ka hana piha a hiki i ka ʻāpana ʻākoakoa a me nā hoʻonā turnkey piha, hāʻawi mākou i nā hoʻonā end-to-end. Kōkua kā mākou ʻike loea i ka hoʻokele wikiwiki ʻana i kāu huahana i ka mākeke a me ke kumukūʻai haʻahaʻa, hoʻonui iā ʻoe i ka hoʻihoʻi ʻana i ka hoʻopukapuka kālā a me R&D, ua lanakila kā mākou hui i ka hapa nui o nā mea kūʻai aku kūloko a me nā haole me ka ʻenehana holomua a me nā huahana no ka manawa lōʻihi.
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Ka mana hana6 mau laina SMT, 4 mau laina DIP, hale hana 8000m², Nā ʻōnaehana hoʻokō hana (MES).
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Hoʻopilikino i ka lawelaweHana ʻana i ka huahana maʻamau e like me kāu mau koi hoʻolālā, ʻenekinia hoʻohuli huahana, cloning huahana.
01
Nā PCB maʻamau
* 1-8 mau papa
* Mea FR-4, CEM-1, Alumini, Kumu Keleawe
* UL, ROHSWIFI moʻo modula.
E ʻōlelo i kēia manawa






















